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Delivery Time : 5-15 Working days
Surface Finish : ENIG / HASL / OSP
Material : FR4 PCB substrate
OperatingTemperature : -40°C to 85°C
Board Thickness : 0.4 – 3.2 mm
AssemblyTechnology : SMT and DIP
Packaging Details : Vacuum Package+Carton Box
Supply Ability : Double Sided: 12000 sq m / month Multilayers: 8000sq.m / month
Operating Frequency : Up to 6 GHz
Power SupplyVoltage : 3.3V, 5V, or 12V
SurfaceFinish : ENIG (Electroless Nickel Immersion Gold)
Operating Temperature : -40°C - 85°C
Insulation Resistance : ≥1000MΩ
Payment Terms : T/T,Western Union,Paypal
Application : Communication devices and systems
Price : Negotiable
Testing : AOI, X-ray, functional testing
Compliance Standards : RoHS, IPC-A-610 Class 2
Layers : 1~64 layers
Solder Mask Color : Green (customizable)
Compliance : RoHS, REACH
Function : Signal processing and transmission
ImpedanceControl : 50 Ohm controlled impedance
SignalIntegrity : High, with impedance matching and shielding
Model Number : PCBA for Communication
Certification : ISO9001, TS16949, UL, RoHS
Brand Name : Support OEM / ODM
Pcb Layers : 2 – 20+layers
Dimensions : Customizable based on design
Component Type : SMD and through-hole components
Place of Origin : China
MOQ : 1-10 pcs
Type : Communication device PCBA
With strict quality control and advanced manufacturing capabilities, we ensure every board delivers signal integrity, reliability, and long-term performance.
Our communication PCBA solutions are widely used in:
| Item | Capability |
|---|---|
| PCB Layers | 1–40 Layers |
| Min Line Width/Spacing | 3/3 mil |
| Assembly Type | SMT, THT, Mixed |
| Component Size | 01005 |
| BGA Pitch | 0.3mm |
| Testing | AOI, X-ray, ICT, FCT |
| Lead Time | 24H Prototype |
We provide stable, tested, and telecom-grade solutions to eliminate these risks.
We support your project at every stage:
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FR4 AOI Testing PCBA for Communication Telecom Networking PCB Assembly 0.4-3.2mm Images |